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**2026 Global Computing Conference — "Megawatt Powers New Infra, Unleashing Supernode Computing Power"**
The 2026 Global Computing Conference, the annual flagship industry event hosted by the Global Computing Alliance, will open at the Shenzhen Convention and Exhibition Center on October 21.
Focusing on innovation in megawatt-scale intelligent computing infrastructure and the development of the supernode industry ecosystem, the conference will follow four core themes: "Strategic Leadership and Global Foresight," "Industry Insights and Trend Analysis," "Scenario-Driven Exploration and Technological Innovation," and "Industry Action and Ecosystem Collaboration."
The event will offer forward-looking insights into industry trends, showcase cutting-edge technological achievements, release authoritative standards and specifications, and present benchmark implementation cases. By strengthening the industry's foundations through tangible achievements and unlocking new momentum through value sharing, the conference aims to build broad consensus on the development of the supernode industry.
Global computing leaders, top experts, and ecosystem partners will gather to witness a defining moment for the global computing industry and chart the technological pathways and future direction of industry innovation.

Anchoring in the strategic vision of sharing China's standardization experience with the global community, this forum brings together representatives from top-tier standardization organizations and pioneering industry leaders to forge a high-level platform for international discourse. The event will comprehensively decode the digital evolution of Chinese standardization in recent years, while exploring the dynamic trends shaping the modern "Standards and Conformity Assessment" ecosystem.
Throughout the forum, experts and leaders will provide in-depth insights into the strategic visions and real-world challenges of driving digital standardization. Discussions will unpack the critical synergies among national, group, and international standards, culminating in the distillation of industry best practices. Ultimately, the forum aims to systematically showcase China's digital standardization blueprint to the world, continuously elevating the core influence of Chinese standards across the global landscape.

Bringing together experts from across the AI infrastructure ecosystem, the forum will explore SuperPoD and GW-scale AIDC technologies, including high-speed interconnects, compute-storage synergy, liquid cooling, and 800V HVDC power systems. It will also address high-density computing cluster deployment, energy efficiency, and standards development, accelerating the large-scale advancement of AI computing infrastructure.

Focusing on SuperPoD technology frontiers and industry practices, the forum gathers industry and research experts from various fields, including standard, system, application, chip & component, and computing infrastructure. The forum will present how SuperPoD architecture and technological innovation can break through the computing and communication bottlenecks of traditional products, achieving higher-efficiency large model training and inference as well as large-scale application deployment. Invited speakers will also showcase the latest practical achievements and research progress, explore new opportunities in the SuperPoD era, foster ecosystem synergy for AI infrastructure , and accelerate intelligent computing empowering diverse industries.

As AI compute clusters are rapidly deployed, new‑generation computing hardware including super‑nodes and GPU‑BOX continues to emerge, raising new requirements for open and intelligent BMC management. This forum focuses on next-generation BMC management technology evolution, with in-depth discussions on northbound self-access, southbound standardization, AI agents, and other core topics. Relevant standards and reference implementations will be released on-site. Joining hands with industry leaders and technical experts, we aim to reach consensus on BMC standards and empower enterprises to adopt a new paradigm of open, intelligent and autonomous compute management.

This forum focuses on computing power lifecycle optimization and Token production efficiency improvement, bringing together industry leaders and ecosystem partners for dialogue on intelligent computing infrastructure development, industrial collaboration, and ecosystem co-building, exploring open, efficient, and sustainable new paradigms for the AI industry.

As AI large models and AI Agents accelerate into deployment, computing infrastructure security — including cloud computing and supernodes — as well as model security and data and privacy security in agent interactions, face a range of real-world challenges. Technologies such as Confidential Computing, Privacy-Preserving Computing, Encrypted-State Computing, Trusted Computing, and Quantum Cryptography have emerged as key means to address these risks. The Computing Security Ecosystem Forum focuses on industry pain points, shares business usecases, and jointly explores pathways for high-quality development of the computing security industry.

The 2026 UWA SUMMIT and World Ultra HD Video Industry Alliance Member Assembly, themed "Boundless Vivid, Collective Intelligence," brings together leading global enterprises, research institutions, and industry experts to explore industry trends, technological innovation, and pathways for ecosystem development.

Centered on the theme "Lighting Up the Tech Tree: Trends and Achievements Release in Consumer Electronics,"this tech innovation forum focuses on empowering consumer electronics innovation through foundational digital-intelligent technologies. It addresses key topics such as the implementation of consumer chips, AI smart terminal strategies, and sustainable industrial development.
By bringing together academicians and industry leaders, the forum decodes the underlying logic of technologies, solidifies the foundation for industrial innovation, and collectively explores the development pathways for the global consumer electronics industry over the next decade.

The 2026 SparkLink Industry Summit, themed "SparkLink AI · Intelligent Integration for All Things", centers on the deep convergence of SparkLink and AI, leveraging intelligent collaboration to unify full industry-chain resources across OpenHarmony, sensing, broadband, and healthcare.
Organized into five chapters—SparkLink Trends, Standard Leadership, Ecosystem Integration, Scenario Innovation, and Win-Win Cooperation—the summit features keynote addresses by distinguished guests, launches standards, OpenLab milestones, products, and global expansion outcomes, showcases real-world deployments in embodied AI, smart manufacturing, and power & energy, hosts MOU signings, unveils the SparkLink + OpenHarmony ecosystem, and accelerates the large-scale commercialization of the SparkLink industry.

Embracing the New, Co-building Smart Spaces——The 2nd Kaihong Innovation and Technology Conference focuses on the theme of "Space + Intelligence." It covers diverse spatial scenarios including offices, industrial parks and buildings, campuses, outdoor districts, consumer scenarios, and radio and television studio centers. The conference will release a series of products and collaborative innovation solutions, launch the Kaihong Smart Space Alliance, and announce the Kaihong Authorized Service Provider Recruitment Program. Representatives from government, industry, academia, research, and application sectors will gather to jointly explore new pathways for the large-scale commercialization of OpenHarmony.

The explosive innovation and growth of AI large models and applications have brought entirely new opportunities and challenges to information and communications infrastructure. The NIDA has gained deep insights into vertical industry scenarios and requirements, and released the Network 2030 Vision research report; benchmark customers in industries such as education and healthcare shared outstanding practices in network-building standards, helping industry network-building standards leap from digitalization to intelligence; and it showcased the results of the Global Pioneer Program, covering major signings, adoption of standards by international organizations, and implementation of standards with overseas customers.

Focusing on the technology, products, and ecosystem of Embodied and Physical Intelligence, this forum gathers key players—from AI model developers and robot manufacturers to ICT providers and academic—to discuss the future of the industry.
Under the theme "Collaborate Cross Domains, Joint Efforts to Ground Physical Intelligence" we emphasize the vital need for cooperation across domains, industrial alliances, and industries. We call on all stakeholders to work together to advance the ecosystem, expand the industry's horizon, and let technological innovation serve the well-being of human society.

Bridging music and technology, this forum focuses on the application of Audio Vivid spatial audio in health scenarios, exploring market demand, content production, and industry standards to advance the industrialization of smart health.

Focusing on the full-chain integration of AI and ultra-HD audiovisual technology, this forum covers everything from chip computing power and large-model tools to terminal operations, with open discussions addressing core challenges such as compute adaptation, standards interoperability, and content IP rights, driving industry-wide collaboration and breakthroughs.

Focusing on end-to-end innovation across the 3D industry, this seminar covers hyper-realistic reconstruction, 6G transmission, next-generation display technologies, and international standards applications, while showcasing commercial success stories in entertainment, e-commerce, and other sectors.

On 26 May 2026, the General Office of the Ministry of Industry and Information Technology, the General Office of the National Development and Reform Commission, the General Office of the State-owned Assets Supervision and Administration Commission of the State Council, the General Office of the China National Intellectual Property Administration (CNIPA), and the General Office of the All-China Federation of Industry and Commerce (ACFIC) jointly issued the *Notice on Launching the 2026 "100 Events for 10,000 Enterprises" Large, Medium and Small Enterprises Integration and Matchmaking Campaign* (Letter GXTLQYH〔2026〕No. 236). Pursuant to this Notice, the Special Session on AI Terminals under the "100 Events for 10,000 Enterprises" Large, Medium and Small Enterprises Integration and Matchmaking Campaign is to be held.
This event will be held concurrently with the CEIC Consumer Electronics Innovation Conference in Shenzhen. This session brings together upstream and downstream enterprises along the AI terminal industrial chain, public service platforms and industry experts to share insights on industrial chain and supply chain development trends, release research results, new products and new technologies, and advance in-depth matchmaking and integrated development between upstream and downstream players of the industrial chain.

As a parallel forum of CEIC 2026 (Consumer Electronics Innovation Congress), hosted by the eSIM IoT Technical Committee of the GIIC (Global Intelligent IoT Consortium), the forum will be held on October 22, 2026 at the Shenzhen Convention and Exhibition Center. Focusing on China's eSIM roadmap, international standards, and industry implementation paths, it brings together stakeholders across carriers, chip vendors, SIM card issuers, terminal makers, and solution providers. Through keynote speeches, roundtable discussions, and result announcements, multiple eSIM white papers will be released, exploring AI-native connectivity and ecosystem collaboration to drive large-scale adoption of the eSIM industry.

At this critical juncture when the global consumer electronics industry is entering the era of "AI-native," the boundaries of the WLAN industry are rapidly extending from home and enterprise scenarios to wide-area networks and digitally intelligent campuses. To this end, the WAA (World WLAN Application Alliance) is hosting this forum. Under the theme "AI-WLAN: Intelligent Connectivity Without Boundaries — Defining the New Network Experience for Consumer Electronics," the forum brings together forces from across the entire industry chain, including international standards organizations, chip manufacturers, equipment vendors, operators, and industry users. Positioned as a "super connector for the global WLAN industry ecosystem," the forum focuses on three major missions: standards collaboration, ecosystem aggregation, and industry leadership. It aims to promote the deep integration of "short-range + wide-area," "standards + applications," and "technology + ecosystem," drive the WLAN industry's strategic leap from "home connectivity" to "scenario-based intelligent connectivity" and from "consumer electronics" to "industry digital intelligence," and support the upgrading of global digital economy infrastructure.

Bringing together leading founders from Kimi, Unitree, Rokid, and other pioneering companies, this forum looks ahead to consumer electronics trends over the next decade. A roundtable discussion tackles AI hardware opportunities and industry pain points head-on, paired with an awards ceremony to energize the Huaqiangbei innovation ecosystem.

Focusing on the industrial upgrading and value realization of consumer electronics amid the AI wave, this initiative covers core sectors including smart terminals, operating systems, smart automobiles and whole-home smart connectivity.
It connects the full industry chain spanning technology R&D, standard certification and industrial implementation, gathers industry leaders, international organizations and academic experts, analyzes the implementation pathways of cutting-edge technologies, explores opportunities for cross-domain ecological collaboration, and simultaneously releases landmark technological achievements and industry consensus, so as to build an in-depth cooperation platform for high-quality innovation across the industry.

The 2026 SparkLink Application Forum interprets "SparkLink AI · Intelligent Integration for All Things" from a technical perspective, bringing together the full-chain capabilities of chips, terminals, and partners.
With embodied intelligence as the core focus and chips as the technology foundation, the forum shares practical deployments across five major technology sectors—audio, smart home, automotive, energy, and manufacturing. It features keynote reports by invited industry experts, launches joint embodied intelligence solutions, hosts a roundtable dialogue, and accelerates the transformation of SparkLink technology from parameter leadership to experience leadership.

Centered on the theme "Intelligent Sensing, Fortifying Low-Altitude Defense," this forum spotlights low‑altitude security infrastructure and innovative low‑altitude application scenarios. Built upon radar‑sensing technology, it establishes a cross‑industry‑chain technology exchange platform spanning microwave & millimeter‑wave chips, new materials, integrated sensing solutions, and artificial intelligence. The event explores paths for joint technological innovation, deliberates on strengthening the low‑altitude‑economy industrial ecosystem, and delivers valuable industry insights to advance the high‑quality development of the low‑altitude economy.

Under the theme "Intelligent Leadership · Industry Consensus," the summit focuses on AI innovation and industry development. It interprets Shenzhen's policies on AI application scenario innovation, delivers keynotes on next-generation AI—from intelligence capability to intelligent companions—and how AI agents empower consumer electronics, and hosts a roundtable on AI innovation trends in the Greater Bay Area, bringing together government, industry, academia, and research to drive AI technological innovation and industrial application in the region.

Under the theme "Intelligent Leadership · Industry Consensus," the summit focuses on urban IoT sensing systems. It interprets Shenzhen's 15th Five-Year Plan on IoT sensing, delivers keynotes on IoT technologies and standardization trends, urban sensing architecture evolution, key technologies and security, scenario applications, and data value. The summit releases standards and guidelines, launches case collection, and hosts a roundtable on "Future Urban IoT Sensing Development and Operation in the Token Economy," fostering consensus among government, industry, academia, and research to drive high-quality industry growth.